Underfill/Liquid Molding compound Material Expert

求人詳細

仕事内容
Focusing on research to fill narrow gaps, such as the development and research of filling techniques for 20um chip-to-chip gaps. It is more desirable to have deep experience in both underfill and liquid molding compound for narrow gap filling, including not only material technologies but also process technologies to fill. Furthermore, it is desirable to have experience in the process technology of compression molding. At least filling for 40 um gap technical experience is required, 20um gap is desirable at the research level.

1. Leading narrow gap filling technologies development with material and equipment companies.
2. Have enough knowledge about underfill and liquid molding compound, and can propose the optimum material property from the viewpoint of void-less filling and reliability. Especially large size chip with narrow gap.
3. Have enough knowledge about filling process technologies including capillary dispense process and compression molding.
Have more than 10 years experience in packaging industry like assembly, material and equipment.

こんな方を求めています

経験・スキル

Job Requirements：
1. Bachelor’s degree or higher.
2. Proficient in underfill and liquid molding compound development and research area.
3. With a strong leadership to cooperate with the surrounding multi-synergistic business units.
4. Have personal strong influence in industry.
5. Active thinking, with a strong ability to innovate.

学歴

大学卒業以上

募集要項

職種

ケミカルエンジニア

給与

年収 800 〜 2,000万円

賞与

-

雇用形態

正社員

雇用期間

期間の定めなし

試用期間

有り

就業時間

09:00～18:00

休日休暇

土曜日　日曜日　祝日

保険

健康保険　厚生年金保険　雇用保険

受動喫煙防止措置

敷地内禁煙

業種

電気・電子・半導体

※詳細はお仕事のご紹介時にお伝えします