大阪の転職求人一覧

【業務内容】・自動化プログラムの作成 / 顧客ニーズに沿ったシステム構築・営業同行（技術情報の説明）・見込み顧客に対し製品のデモンストレーションおよびプレゼンテーションの実施・顧客に対して各種セミナー/取扱い説明の実施・顧客、代理店、当社営業からの問い合わせ対応

Focusing on the FO-WLP/PLP technology developing and research. It is more desirable to have in-depth experience in RDL (redistribution layer) and uBump process and material technologies.For RDL, at least 5/5um line and space technical experience is required, 3/3um line and space 20um is desirable at the research level.For uBump, at least 40um pitch technical experience is required, 20um pitch is desirable at the research level.1. Leading RDL/uBump technology development with material and equipment companies.2. Have enough knowledge about photosensitive polyimide, photoresist, plating liquid and seed etching materials. Able to propose material property required to realize pitch reduction and lead material suppliers.3. Have enough knowledge about photolithography and lead equipment suppliers.4. Have more than 10 years experience in semiconductor industry like IDM, foundry, OSAT, material and equipment supplier.